I got a cheap reflow oven off Amazon. Seems to work, but I am no expert, and there is some advice on the internet about some tweaks and improvements to that model too. However, baby steps.
I also got some solder paste. I do not (yet) have a stencil. So advice on how one uses a solder paste stencil, and what paste you get, and so on, may be useful.
This does, however, pose a problem. Whilst it is very easy to put a spot of paste on the pads for the passives, there is no way in hell I could possibly put paste on each pad on the FT231XQ or USB-C connector. The pins are too fine.
So how to do it. Well, I did wonder if just putting paste over the whole row of pads and relying on surface tension may work. But the other snag is these short turnaround boards from PCB Train have no solder resist. Still, it is worth a try...
Well, not quite. That is the USB-C connector, and you can maybe just see that the end power pads have bridged. As it happens a touch with soldering iron sorted that and all the fine pads were OK. But it is clearly not reliable. Attempts to do this on a simple QFN-16 were less good. I suspect if I got exactly the right amount of paste it might work, but generally, no. And I doubt any chance with a QFN-40.
So what now?
Well, what I was doing with the hot air gun was tinning the pads manually (easy), and putting liquid flux on the chip, and then blasting it. It worked pretty reliably, but the heat was not very controlled and you end up charing the PCB.
So will that work in the over? Well, the short answer is yes! (well sort of)
I tin the find pads, flux the chip and place on tinned pads, solder paste the passives and put them on board, and then reflow. It seems to work most of the time, but occasionally I have to heat gun and push the chip down on to the board to ensure all pins connected.
Just as well, as I have just got the new NFC boards to play with. Fingers crossed.